Sensteed Hi-Tech Group, Ltd. is currently the largest shareholder of Kangqiang Electronics, a leading enterprise in the field of semiconductor packaging materials segmentation. And in 2022, through acquisition indirectly became the largest shareholder of Zhejiang Hexin Integrated Circuit Co., Ltd., a semiconductor innovation company.

Ningbo Kangqiang Electronics Co., Ltd. was established in 1992 and listed on the Shenzhen Stock Exchange in 2007 (securities code: 002119). After thirty years of hard work and fruitful achievements, the company has been deeply involved in the field of semiconductor packaging materials, crossing the industry cycle and continuously expanding and growing since its establishment. The company mainly produces various types of semiconductor packaging basic materials such as lead frames and bonding wires. Downstream packaging products are widely used in various fields such as "5G", automotive electronics, photovoltaic power generation, industrial automation control, green lighting, screen backlight, Internet of Things, household appliances, etc. It is the only listed enterprise among domestic lead frame manufacturers, and the production and sales of lead frames have always been among the top in the world. Currently, it has more than 1000 employees. The company is based on technological innovation and aims to serve the country through industry. It actively promotes the localization of high-end etching lead frames, laying the foundation for the development of large-scale integrated circuits in China. The company is currently one of the top ten semiconductor materials enterprises in China, one of the top fifty electronic materials enterprises in China, and a benchmark enterprise in the semiconductor industry in Zhejiang Province.

Zhejiang Hexin Integrated Circuit Co., Ltd. was established in January 2021 with a registered capital of 990 million yuan. Focusing on advanced packaging and testing technology for mid to high-end integrated circuits, with consumer electronics, 5G terminals, IoT terminals, etc. as the main application directions, we accurately grasp the market capacity gap and are committed to becoming a leading provider of advanced packaging and testing services for integrated circuits in China.